doc. no : qw0905-la110b/ghgg-pf rev. : a date : 08 - mar. - 2010 data sheet led array la110b/ghgg-pf pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
12.45 part no. la110b/ghgg-pf 2.7 2.5 ? ????
typical electrical & optical characteristics (ta=25
3/6 g chip 3.5 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 80 02040 -40-20 0.9 0.8 100 80 5.0 4.0 3.0 2.0 1.0 0.5 0.0 650 600 550 500 1.2 1.1 1.0 60 40 20 0 -20 -40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000 100 10 1.0 1000 100 10 1.0 0.1 1.0 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) page f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature(
dip soldering preheat: 120 25 0 0 50 120 100 150 temp( 260
the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. 1.t.sol=230
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